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machine specifiion backgrinding

  • Wafer Backgrinding Services Silicon Wafer Thinning Services

    Wafer backgrinding or wafer thinning is a semiconductor manufacturing process designed to reduce wafer thickness. This essential manufacturing step produces ultra-thin wafers for stacking and high-density packaging in compact electronic devices. The silicon wafer backgrinding process is complex.

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  • DAS8930 Surface Planer Product Information DISCO

    Ultrahigh-precision planarization technology using a diamond bit. The DISCO surface planer provides solutions for high-precision planarization of ductile materials such as metals resins and their composites as well as solutions for reducing bump height variation and surface roughness.

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  • USB2Method and apparatus for wafer backgrinding

    A workpiece processing apparatus is provided. The apparatus includes a rotary turntable having one or more spindles thereon the turntable being configured to rotate about a turntable axis. Each of the spindles is configured to receive and secure thereon a workpiece to be processed by the apparatus. Each of the spindles can rotate about their own independent axes.

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  • Spectroscopic Measurements of Silicon Wafer Thickness for

    The optical microgauge system by means of near-infrared spectroscopic measurements was proposed as the thickness monitoring tool in the silicon wafer thinning process. The Fabry-Pelot interferometry and Beer s law were employed as the principles of the system for extracting the wafer thickness from optical spectroscopic system prototyped in this study.

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  • Standard Backgrind Backgrinding Applications Electronics

    Norton Winter Mesh as Applied to Backgrinding Wheels Above mentioned specifications are for the finish grinding spindle. The rough grinding spindle normally uses a #320 wheel. The finish obtained are on 8" Si wafers. The estimated life (relative) is depicted for the above specifications on 8" Si wafers.

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  • Alumina Ceramic CNC Machining Quartz Fused Silica CNC

    From CNC machining to precision lapping optical polishing ultrasonic hole drilling production dicing backgrinding wafering edge polishing and beveling Valley can do it all. Special capabilities include ultra-thinning polishing to Angstrom level finishes micron level tolerances and tight flatness parallelism and TTV specifications.

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  • Thin Wafers Backgrinding Applications Electronics

    Thin Wafers. Grinding thin wafers (less than 150 um) on an old grind tool model may not be a great pleasure. Either an extra process step (etching) may need to be introduced or a new capital investment needs to be made to improve the yields.

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  • Back Grinding Tape Line-up ELEP HOLDER Nitto

    At Nitto various products meeting the advanced needs of numerous processes during electronic device production are created based on a wealth of experience and knowledge gained in the field of electric and electronic materials.

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  • DAS8930 Surface Planer Product Information DISCO

    Ultrahigh-precision planarization technology using a diamond bit. The DISCO surface planer provides solutions for high-precision planarization of ductile materials such as metals resins and their composites as well as solutions for reducing bump height variation and surface roughness.

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  • Wafer Thickness Gauge 쎄미모토(주)코머신

    Backgrinding 전 후 공정에서 Wafer의 두께를 측정하는 기구이다. Specification. Model SMWT1001 Object Thickness of 8 12 inch Wafer Chuck Porouschuck 측정 Sensor Reel taping Inspection Machine. 공정 개선 시스템

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  • A Comprehensive Study for Specialized Silicon- on

    Fig. 4. Vertical scratches after wafer backgrinding Source Bacquian and Gomez 4 Fig. 5. Chuck table design Table 1. Backgrinding tape configuration Specification Unit Conventional UV Tape Total thickness microns 125 120 Adhesive thickness microns 20 40 Adhesion strength Before UV N / 25 mm 2.84 6.5 After UV 0.1

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  • Protection Tape Remover for Backgrinding Process NEL

    Protection Tape Applicator for Backgrinding Process NEL SYSTEM® Series This equipment applies protection tape on the wafer patterned surface for the back-grinding process. Full-auto type Semi-auto type machines are lined up and large size wafers are also available.

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  • Fast and precise surface measurement of back-grinding

    Therefore a modern wafer grinding machine begins with a coarse grinding wheel to get a fast removal of the silicon and at the end follows a fine grinding process step with small grit size grinding wheel. This final process is absolute necessary when thinning down to 50 μm in

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  • Grinding Wheels NORITAKE CO. LIMITED

    Noritake Grinding wheels are used in a wide variety of industries such as automotive steel and bearing markets. Our advance technical expertise is the reason why we are one of the top manufacturers in the global abrasive market. The Noritake abrasive products are made from a wide variety of materials including alumina silicon carbide and special ceramics. Noritake also provides

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  • Poligrind Grinding Wheels Product Information DISCO

    Poligrind is designed to be used on the second spindle of precision in-feed grinders. Without any change in processes or addition of equipment Poligrind helps improve post-grinding surface roughness die strength and overall process quality.

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  • Grinding of silicon wafers A review from historical

    Figure 1 shows a schematic view of a lapping machine used in an HDD manufacturing process. It basically consists of a plate a moving arm (or slider arm) a clamping tool (CT) and a place where a

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  • Silicon Machining Glass Machining Services

    Precision Machining CNC Machining of Hard Materials Valley Design is a custom fabricator of precision machined parts from Glass Pyrex Quartz Fused Silica (SiO 2) Sapphire (A Plane C Plane R Plane) Aluminum Oxide (Alumina Al 2 0 3) Aluminum Nitride (AlN) Silicon Carbide (SiC) Boron Carbide Steatite Silicon Zerodur Macor composites and other ultra-hard materials.

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  • Protection Tape Applicator for Backgrinding Process NEL

    Nitto Website Always one step ahead in making good things happen with its sheets and films Nitto is creating a constant stream of Global Niche Top® products including advanced optical

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  • What You Need to Know about Germanium Wafer Backgrinding

    Mar 17 2020 · The machine picks up the wafer from its untapped side using a robotic arm. It then positions the wafer for backgrinding. A grinding wheel carries out the backgrinding process following an accurate set of specifications like D/I water temperature spindle coolant water temperature flow rate wafer thickness and feed speeds to guarantee

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  • Silicon Wafer Back GrindingMC World C

    Wafer Backgrinding Silicon Wafer Thinning Wafer Wafer backgrinding is an effective and time-efficient method of reducing silicon wafer thickness for use in se. Equipment can service machines worldwide to make sure your operation runs smoothly. 7(927)687 07 58

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  • Etching (microfabrication)Wikipedia

    Etching is used in microfabrication to chemically remove layers from the surface of a wafer during manufacturing. Etching is a critically important process module and every wafer undergoes many etching steps before it is complete. For many etch steps part of the wafer is protected from the etchant by a "masking" material which resists etching.

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  • Diamond Backgrinding WheelsSMART CUT technology

    U sed on backgrinding machines for thinning and flattening silicon wafers glass products ceramic products. Sizes range from 8" to 14" O.D. Used on machines manufactured by Disco Okamoto Strasbaugh and many others. Available in large variety of bond such as sintered (metal bond) resin bond vitrified bond plated (nickel bond).

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  • Wafer Backgrinding Wafer Dicing Wafer Inspection

    We are at the forefront of wafer dicing backgrinding and inspection and have the expertise to process semiconductor and silicon wafers to your unique specifications. Our goal is to achieve creative solutions where problems exist and deliver quick cycle times without sacing quality. Let Syagrus Systems be part of your engineering team

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  • Wafer Backgrinding Wafer Dicing Wafer Inspection

    Syagrus Systems provides a variety of silicon wafer processing services to meet your needs. All services are designed to be "consistently flexible " in that we can easily modify our processes and react quickly to your needs while documenting each step for consistency and repeatability. Our customer base is extremely diverse and represents all segments of the semiconductor industry including

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  • BACK GRINDING WHEELEHWA DIAMOND

    Specifications BACK GRINDING WHEEL 1) Rough grinding (Z1) 1. Vitrified bond (#400 800) ① Higher feed rate for better UPH. ② Low and consistent grinding current and longer wheel life time 2. Resin bond (#325 600) ① Less edge chipping and grinding damage on thin wafer ② Excellent grinding ability without compromising wheel life time

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  • Wafer Back Grinding TapesAI Technology Inc.

    Tight tolerance of controlled release within 25 of peel strength specification for controlled manufacturing. 150 micron and 300 micron adhesive-compliant layer to accommodate gold-bumped and solder-bumped wafers for accurate and stress-free thinning.

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  • USB1Abrasive tools for grinding electronic

    Abrasive tools containing high concentrations of hollow filler materials in a resin bond are suitable for polishing and backgrinding of hard materials such as ceramic wafers and components requiring a controlled amount of surface defects. These highly porous abrasive tools comprise fine grit abrasive grain such as diamond abrasive along with the hollow filler material and resin bond.

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  • Dual mode control of the rotational grinding process

    Jan 01 2012 · 1. Introduction. The rotational grinding process is widely used in the production of silicon substrates for semiconductor integrated circuits. The fundamental configuration is regarded as optimum for producing large diameter substrates that meet industry specifications for total thickness variation (TTV) and site flatness (SFQR) .The process is also used for "backgrinding" after

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  • Backgrinding Tape Selection Analysis for Adhesion Problem

    129 backgrinding machine is used with installed UV curing and de taping process up to wafer 130 mounting for all the three evaluation wafers. The BG machine have also same machine 131 setting of same mounting and detaping chuck table temperature of 33.5 ± 5°C and 40-50°C 132 respectively across the evaluation. 133

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  • DISCO DFG 840/841 GrinderS3 Alliance

    Refurbished DFG Backgrinding Systems. This unit features two-spindle three-rotary-chuck table specifications allowing high-quality ultra-thin grinding for thin wafers 3D integration bonded wafers etc. With two-spindle two-chuck table specifications and a robot arm the Disco 840 and 841 machines feature a same-cassette return

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  • (PDF) Ultrathin Wafer Pre-Assembly and Assembly Process

    Subsequently another type of backgrinding machine called. an in-feed wafer grinder was developed. 11 94–96. with capability. of producing better TTV on ground wafers. Figure 21 illus-

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  • UH110-8 Wafer Backgrinding Tape RemoverSPS-Europe

    UH110-8 Wafer Backgrinding Tape Remover Ultron Systems Model UH110 and UH110-8 Semiautomatic Film Removers demount film from 3" to 8" wafers after the backgrinding or etching process. The virtual 180° peeling angle ensures more efficient peeling and lower stress on the wafer resulting in higher yields.

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  • DISCO DFG 840/841 GrinderS3 Alliance

    Refurbished DFG Backgrinding Systems. This unit features two-spindle three-rotary-chuck table specifications allowing high-quality ultra-thin grinding for thin wafers 3D integration bonded wafers etc. With two-spindle two-chuck table specifications and a robot arm the Disco 840 and 841 machines feature a same-cassette return

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  • Protection Tape Remover for Backgrinding Process NEL

    Protection Tape Applicator for Backgrinding Process NEL SYSTEM® Series This equipment applies protection tape on the wafer patterned surface for the back-grinding process. Full-auto type Semi-auto type machines are lined up and large size wafers are also available.

    Chat Online
  • Protection Tape Applicator for Backgrinding Process NEL

    Nitto Website Always one step ahead in making good things happen with its sheets and films Nitto is creating a constant stream of Global Niche Top® products including advanced optical

    Chat Online
  • What You Need to Know about Germanium Wafer Backgrinding

    Mar 17 2020 · The machine picks up the wafer from its untapped side using a robotic arm. It then positions the wafer for backgrinding. A grinding wheel carries out the backgrinding process following an accurate set of specifications like D/I water temperature spindle coolant water temperature flow rate wafer thickness and feed speeds to guarantee

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